SOLDER PASTE RMA NC13-88
¨ Formula 30: RMA No-Clean ¨ Class 1 Alloy: 63Sn/37Pb
¨ Type 3 Powder: -325/+500 Mesh Powder ¨ Metal Content: 88%
³ Residues and characteristics pass Bellcore. ³ Translucent residue
³ Meets IPC requirements for ROL0, No-Clean. ³ No slump
³ Superior wetting characteristics, lot-to-lot consistency, and stable viscosity ³ Long tack time
³ Halide-free, halogen-free ³ Air reflow
³ Capable of printing 12 mil pitch ³ Viscosity is 750,000 – 900,000 kcps*
³ Post-solder joints are pin-testable
³ For Nitrogen or air atmosphere reflow ovens
* Viscosity can be adjusted to meet process requirements.
RECOMMENDED PROCESSING GUIDELINES
I. PRINTING
Tack Time for Amerway Inc Solder Paste RMA NC13-88 is sixteen (16) hours between printing, placement and reflow under ambient conditions below 23°C/74°F and a relative humidity below 60%. The exact time will depend on the environmental condition of the solder paste and plant. The ideal temperature range for operation of the solder paste is 20°C/68°F – 23°C/74°F, with a relative humidity of 35-55%. The viscosity of this solder paste is 750,000 to 900,000 kcps on the Brookfield viscometer.
Should printed circuit boards need to be stored for more than 6 hours after populating, prior to reflow, it is recommended that PCBs are maintained in a tightly controlled area. Humidity should be controlled between 35% - 55% and temperature should not exceed 23°C/74°F.
II. RECOMMENDED REFLOW PARAMETERS
63Sn/37Pb and 62Sn/36Pb/2Ag in No-Clean Formulation
u PREHEAT ZONE: Ramp from room temperature to 120°C in 45-120 seconds to dry the volatiles from the solder paste.
v SOAK ZONE: Ramp from 120-150°C in 30-60 seconds to get uniform temperature equilibrium of PCB.
w REFLOW ZONE: 1) Ramp from a temperature of 150°C to 183°C for a period of 10 - 60 seconds*.
* Time above 183°C should not exceed 60 seconds.
2) Ramp from 183°C to 210C-220°C ± 5°C for 16 – 45 seconds**.
** Time above 210°C should be no less than 10 seconds, and no more than 30 seconds
x COOLING ZONE: A cool down rate of 1-2°C per second is recommended for optimum results.
y CLEANING LAG TIME: Cleaning efficiency is not affected by lag time between the reflow and cleaning process.
II. POST-SOLDER CLEANING
Amerway Inc Solder Paste RMA NC13-88 is a No-Clean paste formulated to remain on PCBs after reflow. While no post-solder cleaning is required for the residue, all residues may be removed in an aqueous cleaning process.
Wet solder paste is easiest to remove using Isopropanol or other similar solvents. If printing interval exceeds two (2) hours, remove solder paste from screen stencil and store in a separate container.
IV. STENCIL CLEANING
Stencils should be cleaned using a semi-automated stencil cleaning system, hand wipes, or by hand-wiping the stencils with Isopropanol and/or other alcohol solvents.
V. STORAGE
The following conditions are recommended to achieve long-term stability and the assurance of fresh solder paste:
· To achieve a shelf life of 6-12 months, store in a freezer below 0°C/32°F.
· To achieve 3-9 month storage life, store in a refrigerator, 1°C/33°F-12C/55°F.
· For non-refrigerated/frozen storage, maintain in a cool and dry location. Maximum temperature should not exceed 23°C/75°F. A storage time of up to 3 months can be expected.
· Avoid direct sunlight.
VI. SAFETY
Amerway Inc Solder Paste RMA NC13-88 is a product formulated for use in assembly processes that require safety precautions be taken. Avoid contact with skin and eyes. When using, do not eat, drink, or smoke. Wear gloves and eye protection. Most alloys contain lead; wash hands if hands come in contact with the product.
Observe industrial hygiene and safety practices to assure conformance with local, state, and federal safety health and environmental regulations.
Adequate ventilation should be provided when soldering. Refer to the Material Safety Data Sheet (MSDS) for additional information.
VII. PACKAGING
· Jars of 250 or 500 grams available.
· Cartridges available in 500 gram, 600 gram, and 700 gram amounts.
· Syringes available in 10cc (10-30 grams) and 30cc (50-75 grams) sizes.
VIII. TECHNICAL TEST DATA
QQS-571E ANSI/IPC SF-818
Resistivity of Water Extract: Pass Copper Mirror Test: Pass
Silver Chromate Paper Test: Pass Silver Chromate Test: Pass
Copper Mirror Test: Pass Solids Content, Alloy: 90%
Flux residual solid after reflow: 3.3%
Halide Content: -0-
Bellcore (TR-NWT-000078) ANSI/IPC SP-819
Halogen Content: -0- Solder Ball Test: Pass
Copper Mirror Test Pass Wetting Test: Pass
Surface Insulation Resistance Test >1X1010 Slump: -0-
Class 3 Alloy conforms to Mil-STD-45662 and Mil-I-45208