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GUIDELINES FOR SOLDERPASTE I. REUSE OF USED SOLDER PASTE
Used solder paste, for the purposes of this definition, is defined as the material left on the printer at the end of the day or work shift. If lumps are paste, do not reuse. Save only moist solderpaste surrounding the squeegee. Do not reuse drier solder paste on the outer periphery of the stencil. Used solder paste should be stored in separate containers.
Solder paste should be reused only once. Blend fresh and used solder paste in a 1:1 ratio.This will restore the rheology of the used solder paste. This paste should be the first paste used. Do not restore mixed paste. For best results, use solder paste immediately.
II. STORAGE
All paste should be stored in a cool and dry environment at temperatures below 74°F/23°C. For optimum results, paste should be stored in a refrigerator or freezer. Always bring the product to ambient temperature gradually before opening the jar/cartridge. For more information see warranty in recommended parameters and conditions. Time required under ambient temperature of 68-74°F/20-24°C before use:
Container Size Freezer Refrigerator
Temperature <32°F/0°C 35-55°F/2-18°C 200 grams 1 hour 1-1/2 hour 250 grams 1-2 hours 1 hour 500 grams 24 hours 24 hours 750 grams 3-5 hours 24 hours 1000 grams Overnight 2-5 hours
III. STIRRING SOLDER PASTE
Gently stir solder paste 15-30 seconds or until homogeneous before placing it on the printer. Keep container lid tightly sealed except when removing or replacing solder paste. Do not mix water or alcohol into solder paste. It can destroy the rheology.
IV. CLEAN-UP
· Water-soluble solderpaste - use warm water.
· RMA and No-Clean solder paste - use alcohol or similar solvents.
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