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Amerway #825 No-Clean Solder Flux Technical Data Bulletin

Technical Data Sheet

Description:
Amerway 825 No-Clean Low Residue Flux is specially formulated low solids flux free of any halides, rosin or resin. This flux was designed for soldering high quality electronic printed circuit boards such as, through hole, mixed technology, and surface mount assemblies while eliminating the need of a post cleaning process. Amerway 825 No-Clean Flux features enhanced foaming properties as well as increased activity and low odor.
Application:  
Amerway 825 No-Clean Flux may be applied by foam, spray or wave application. The topside board preheat temperature recommended is 180-220ºF. For obtaining the best soldering results use the following guidelines:
  -Maintain a consistent foam-head by narrowing of the flux chimney or the use of dual flux stones.
  -Add fresh flux to maintain proper flux level.
  -Regularly clean the fluxing equipment. Never leave foam stone in flux when pressure is not stones.
  -Clean fluxing stone in flux thinner.
  -When foam fluxing, flux can be maintain by monitoring the specific gravity, however, control by checking acid number determination is recommended.
  -Add flux thinner when needed.
Benefits:  
  - Excellent surface wetting
  - Eliminates the need for post soldering cleaning.
  - Increased activity.
  -May be conformal coated without post-cleaning.
  -Conforms to Bellcore Specification TR-NWT-000078, Issue 3, December 1991.
  -Conforms to the Joint Industry Standard ANSI/J-Str-004, Type M/LO.
Properties:    
  Specific Gravity @ 25 C 0.8105
  Pounds / Gallon 6.75
  Color Water white & clear
  Halide Content None
  Acid Number 25.0
  Fluoride Test Passed
  Silver Chromate Paper Test Passed
  Solid Content 2.0
  Flash Point 58ºF TCC
  Copper Mirror Corrosion Test Passed
Surface Insulation Resistance:  
  7 days @ 85ºC/ 85%RH  
  Minimum Requirements 1.0 x 10³ Ohms
  Uncleaned 4.2 x 10¹² Ohms
  Cleaned DI water @150ºF 4.2 x 10¹² Ohms
Bellcore Specification Tests TR-NWT-000078:
  Test Pattern: Standard Bellcore test pattern, 0.025 inch wide lines, 0.050 inch spacing.
  Environment: 35 C, 90% relative humidity
  Bias Voltage: 45-50 volts D.C.
  Test Voltage: 100 volts D.C.
  Boards Initial Reading Final Reading
  Control 8.21 x 10^12 9.45 x 10^12
  Pattern Face Up 7.45 x 10^12 3.41 x 10^12
  Pattern Face Down 7.15 x 10^12 4.12. x 10^12
Electromigration Resistance Test:  
  Test Pattern:     IPC-B-25 test pattern, 0.0125 inch space, 0.0125 inch wide lines.
  Environment:   85 C, 85% Relative Humidity
  Bias Voltage:   45-50 Volts D.C.
  Test Voltage:  100 volts D.C.
  Conditioning Potential:   0  
  Initial Reading: 96 hours
  Final Reading: 500 hours
Boards Initial Reading Final Reading
Control 4.91 x 10^11 5.23 x 10^11
Pattern Face Up 5.60 x 10^11 8.21 x 10^11
Pattern Face Down 7.12 x 10^11 8.11 x 10^11

Visual Examination: No evidence of dendrites or corrosion when viewed at 10 X
magnification.

Safety and precautions:
Flammable liquids should be stored in a dry, well ventilated area away from open flames, sparks or direct heat. As with all Amerway products, a Materials Safety Data Sheet is available.
Packaging:
Amerway 825 No-Clean Soldering Flux is available in 1 gallon containers, 5 gallon containers and 55 gallon drums.
Disclaimer:
The information contained herein is based on data considered accurate and is intended for use by persons having technical skills, at their own discretion and risk. Since conditions of use are outside of Amerway’s control, we can assume no liability for results obtained or damages incurred through the application or the data presented, nor
can we assure customers of liability.
 
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